New class of easy dispersible rheology modifiers - for solvent-borne and solvent-free IC formulations

 
A new class of rheology modifiers for solvent borne and solvent free IC formulations has been developed by Lehmann&Voss which can easily be activated at very low process temperatures. At the same time these rheology modifiers need neither a time and temperature controlled process, nor a pre-activation/solvation step within polar solvents. It will be shown how the properties of the products result in a reduced complexity of the production process of IC formulations and how they can contribute to a time-saving process design. Furthermore the presentation will generally introduce the application-benefits of the modifiers and particularly demonstrate their capabilities to achieve high sag resistance and notably improved storage stability.