High molecular weight polyurethane hot-melts

 
During the ECS 2019 we presented for the first time the use of high molecular weight PUR hot-melts for adhesive applications which match their dispersion and solventborne counterparts in low activation and high initial strength performance. Even though we see a clear trend towards using thermoplastic adhesives, demanding applications require properties that make crosslinked systems mandatory. Hence, we have extended this logic to latent reactive adhesive hot-melts. We will present how superior application performance is achieved by the combination of polymer design, understanding the specifics of PUR high temperature rheology and tailoring this according to the needs of selected applications like sports & leisure and automotive. Further, we will demonstrate the opportunities of this technology to enable automation through their highly precise application, which we call digital printing.